Cart 2 india

Specification
Brand : Jeteokar
BulletPoint1 : Absorb Heat Quickly -- Made of pure copper , the thermal conductivity up to 401W/(mK.). Copper heat sinks has nearly double the thermal conductivity than aluminum.
BulletPoint2 : Heatsink Exteral Size: 1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm. Widely used for Electronic, CHIP, 3D printer, MOS, IC computer 's component, etc.
BulletPoint3 : Skiving Fins Process -- This creates more surface area and opportunity for heat dissipation.
BulletPoint4 : Preventing Overheating -- Heat sink sucks the heat away that can reduce the risk of hardware failure due to overheating.
BulletPoint5 : Thermal Conductive Adhesive Tape Included -- You can use the thermal pad adhesive and bond this to whatever you need to cool.
Color : Copper
CoolerHeatsinkCompatibility : AMD RX6700XT GPU
ExternallyAssignedProductIdentifier : 6091022470197
ExternallyAssignedProductIdentifier1 : 743447008863
ExternallyAssignedProductIdentifier2 : 0743447008863
GpsrSafetyAttestation : 1
IncludedComponents : heatsinks
ItemName : 2Pcs Pure Copper Heatsink 1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm Heat Sink for Electronic 3D Printer CHIP IC MOS Heat Dissipation
ItemPackageDimensions_Height : 13.4874 centimeters
ItemPackageDimensions_Length : 3.7084 centimeters
ItemPackageDimensions_Width : 7.1882 centimeters
ItemPackageQuantity : 4
ItemTypeKeyword : desktop-computer-heatsinks
Manufacturer : Jeteokar
Material : Copper
ModelNumber : 35x35x7mm
MountingType : Panel Mount
NumberOfItems : 1
PackageLevel : unit
PartNumber : 2P-JR221-US
ProductDescription :

Copper heatsink is a popular thermal management option among electronic devices because of its capacity to absorb heat relatively quickly. 

Made of pure copper , the thermal conductivity up to 401W/(mK.). Copper heat sinks has nearly double the thermal conductivity than aluminum. 

It is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to air, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. 

Widely used for Electronic, CHIP, 3D printer, MOS, IC computer 's component, etc.

Spesification: 

Material: Pure Copper

Processing method: Skiving fin

Finishing: Antioxidant treatment

Exteral Size:  1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm

Bottom Thickness: 0.12"/ 3mm

Copper Fin Thickness: 0.02"/ 0.4mm

Package Included: 

2 x Copper Heatsink

ProductSiteLaunchDate : 2022-07-24T04:42:12.277Z
Size : 14x14x7mm
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredDgHzRegulation1 : not_applicable
SupplierDeclaredDgHzRegulation2 : not_applicable
SupplierDeclaredDgHzRegulation3 : not_applicable
SupplierDeclaredDgHzRegulation4 : not_applicable
SupplierDeclaredDgHzRegulation5 : not_applicable
UnitCount : 1
UnspscCode : 32131000