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Specification
Brand : BEIDUOYANG
BulletPoint1 : Heatsink is widely used for computer,chip,CPU,Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, etc.
BulletPoint10 : Capacity efficiency: This item uses advanced technology to maximize capacity efficiency, reducing fuel consumption and carbon emissions
BulletPoint2 : 22 x Heatsink Size:9mm x 9mm x 12mm / 0.35 x 0.35 x 0.47(L*W*H) color:Black
BulletPoint3 : Heatsink cooler is made of aluminum material for durability and reliability in heat dissipation,The groove design increases the heat dissipation area and speeds up the heat dissipation.
BulletPoint4 : Easy to install: easy to use and assemble, put the heat sink only under the device.
BulletPoint5 : The size is measured by manual, please allow the error +/-0.1 inch before purchasing.
BulletPoint6 : Part Name:Cooling Fan Assembly
BulletPoint7 : Design:Single Fan
BulletPoint8 : Quiet operation: This item operates quietly, ensuring a comfortable driving experience without unnecessary noise
BulletPoint9 : Easy installation: This item is easy to install, saving you and hassle
Color : Black
CoolingMethod : Air
ExternallyAssignedProductIdentifier : 7624291110885
ExternallyAssignedProductIdentifier1 : 0725553656466
ExternallyAssignedProductIdentifier2 : 725553656466
FanCount : 1
IncludedComponents : electronic-cooling-fans
ItemName : BEIDUOYANG Phone Cooling Plate Heat Sink Expend Cooling Area for Cooling Fan Reusable Superconducting Silicone Uniform Radiator Pad Semiconductor Heat Sink
ItemPackageDimensions_Height : 0.5 inches
ItemPackageDimensions_Length : 0.5 inches
ItemPackageDimensions_Width : 0.5 inches
ItemPackageQuantity : 22
ItemTypeKeyword : desktop-computer-heatsinks
Manufacturer : BEIDUOYANG
Material1 : Silicone
Material2 : Aluminum
ModelName : electronic-cooling-fans
ModelNumber : mea230803ee000163
MountingType : Panel Mount
NumberOfItems : 1
PartNumber : BEIDUOYANG
ProductDescription : Phone Cooling Plate Heat Sink Expend Cooling Area for Cooling Fan Reusable Superconducting Silicone Uniform Radiator Pad semiconductor heat sinkFeatures:The cooling pad can cool the CPU and at the same for time.The phone pad is a plate that neutralizes the heat on the back of the mobilephone. It cannot achieve cooling effect when used alone. Please use with semiconductor in order to achieve better results.The adhesive surface is nano-silica gel material, which can be reused after rinsing with water.The phone cooling pad needs to be used with a fan.The cooling pad only,other accessories demo in the picture is not included!Specifications:Material:Aluminum AlloySize:Approx.11x6.2cm/4.33x2.44inColor:BlackPackage Includes:1x PadNote:Please allow 1-2cm errors due to manual measurement,pls make sure that you do not mind before you order. Due to the difference between different monitors, the picture may not reflect the actual color of the item.
ProductSiteLaunchDate : 2024-04-16T00:29:38.000Z
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
UnspscCode : 43201619