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Specification
Brand : Generic
BulletPoint : Package Includes: SOT89-3L | Pin pitch :1.5mm | IC body size :2.5mm | Structure: Clamshell | Temp -45~+175
BulletPoint1 : Package Includes: BGA67 , VFBGA67 | Pin Pitch:1.0mm | Pin Count:67 pins | IC Size:10.5*13mm | Structure:OPEN-TOP | Material & Performance: | socket Body: PEI | Contacts:Beryllium Copper Alloy | Contact Plating:Gold over Nickel | Operation Force:2.0KG min, the more PINs the greater force. | Contact Resistance:50m max | Dielectric:700V AC for 1 minute | Insulation Resistance:1,000M 700V DC | Max Current Capacity : 1A | Temperature Rating:-55~+175 | Life Span 25,000 Times (Mechanical) | A:
BulletPoint2 : 1.Welding structure :
BulletPoint3 : Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and
BulletPoint4 : effort , and once the socket is welded , it cant be recycle .
BulletPoint5 : 2.No need of welding structure :
ItemName : Wiring Connecting Terminals - BGA67-0.8 Open TOP Burn in Socket pin Pitch 0.8mm IC Size 10.5 * 13mm BGA67(10.5 * 13)-0.8 BGA67 VFBGA67 Burn in Socket
ItemTypeKeyword : dip-sockets
Manufacturer : CHIKIMIKI
NumberOfItems : 1
PartNumber : CNCKE3A0AF5CA50F8A0F802ED43AD1E87C28
ProductDescription : BGA67-0.8 OPEN TOP Burn in socket pin pitch 0.8mm IC size 10.5*13mm BGA67(10.5*13)-0.8 BGA67 VFBGA67 burn in socket
Specifications:
Part number:BGA67(10.5*13)-0.8 socket
IC Package includes:BGA67 , VFBGA67
Pin Pitch:1.0mm
Pin Count:67 pins
IC Size:10.5*13mm
Structure:OPEN-TOP
Material & Performance:
socket Body: PEI
Contacts:Beryllium Copper Alloy
Contact Plating:Gold over Nickel
Operation Force:2.0KG min, the more PINs the greater force.
Contact Resistance:50m max
Dielectric:700V AC for 1 minute
Insulation Resistance:1,000M 700V DC
Max Current Capacity : 1A
Temperature Rating:-55~+175
Life Span 25,000 Times (Mechanical)
A:Tips:
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Thanks.
B.BGA socket New creation
a.connect with PCB ways Innovation
Welding structure : No need of welding structure:
Way:Fix by welding Way:Fix by 4 screws
Pin length1.83mm Pin length0.25mm
Two structure Features:
1.Welding structure :
Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and
effort , and once the socket is welded , it cant be recycle .
2.No need of welding structure :
Adopt innovative screws locking type to fix the sockets and PCBA board , make sure contact is
stable , meantime shorten the assembly time , time-saving and reduce effort , and socket
can be removed from the PCBA board , recycle and reduce test cost .
b.Connect with IC ways Innovation
1.Open-top/Clamshell structure
2.Accommodates pitch :4/0.5/0.65/0.8/1.0mm
3.Compact size and low Actuation Force
4.Field exchangeable package location plate
5.Ucontact support any type of solder ball shape
Ball\\no ball\\damaged ball,the drop of contact
surface is more than 0.2mm
C.HD picture to show the detailed
ProductSiteLaunchDate : 2024-11-09T02:26:43.228Z