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Specification
Brand : Generic
BulletPoint1 : 1.Welding structure :
BulletPoint2 : Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and
BulletPoint3 : effort , and once the socket is welded , it cant be recycle .
BulletPoint4 : 2.No need of welding structure :
BulletPoint5 : Adopt innovative screws locking type to fix the sockets and PCBA board , make sure contact is
ItemName : Wiring Connecting Terminals - BGA96 Clamshell Socket Pitch 0.8mm IC Size 11.6 * 7.95mm BGA96(11.6 * 7.95)-0.8 BGA96 VFBGA96 Programmer Socket
ItemTypeKeyword : dip-sockets
Manufacturer : CHIKIMIKI
NumberOfItems : 1
PartNumber : CNCK1861C2B6D75097F55BFAD01FDA225219
ProductDescription : BGA96 Clamshell socket pitch 0.8mm IC size 11.6*7.95mm BGA96(11.6*7.95)-0.8 BGA96 VFBGA96 programmer socket
Specifications:
Part number:BGA96(11.6*7.95)-0.8 socket
IC Package includes:BGA96 , VFBGA96
Pin Pitch:0.8mm
Pin Count:96 pins
IC Size:11.6*7.95mm
Grid ball:12*8
Structure:OPEN-TOP
Material & Performance:
socket Body: PEI
Contacts:Beryllium Copper Alloy
Contact Plating:Gold over Nickel
Operation Force:2.0KG min, the more PINs the greater force.
Contact Resistance:50m max
Dielectric:700V AC for 1 minute
Insulation Resistance:1,000M 700V DC
Max Current Capacity : 1A
Temperature Rating:-55~+175
Life Span 25,000 Times (Mechanical)
A:Tips:
, ,please leave message to us.
Thanks.
B.BGA socket New creation
a.connect with PCB ways Innovation
Welding structure : No need of welding structure:
Way:Fix by welding Way:Fix by 4 screws
Pin length1.83mm Pin length0.25mm
Two structure Features:
1.Welding structure :
Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and
effort , and once the socket is welded , it cant be recycle .
2.No need of welding structure :
Adopt innovative screws locking type to fix the sockets and PCBA board , make sure contact is
stable , meantime shorten the assembly time , time-saving and reduce effort , and socket
can be removed from the PCBA board , recycle and reduce test cost .
b.Connect with IC ways Innovation
1.Open-top/Clamshell structure
2.Accommodates pitch :4/0.5/0.65/0.8/1.0mm
3.Compact size and low Actuation Force
4.Field exchangeable package location plate
5.Ucontact support any type of solder ball shape
Ball\\\\no ball\\\\damaged ball,the drop of contact
surface is more than 0.2mm
C.HD picture to show t
ProductSiteLaunchDate : 2024-11-09T02:24:15.070Z