Specification Brand : Generic BulletPoint : Package Includes: BGA169,BGA153 | 2) Support eMMC: thickness= 0.8~1.5mm, pin pitch= 0.5mm | 3) Long life span: 100,000(Mechanical) | 4) Support all brand eMMC,such as For Samsung, Hynix, Sandisk, For Toshiba, Intel, Kingston etc | 5) Well designed to connect flat bottom, solder ball,even if no ball. | This socket includes the size limiter(s) of 11x10mm. | If you want other type, please open below links and add it to the cart. | sa_k83yvh_fssa_k83yvh_fssa_k83yvh_fs BulletPoint1 : Color: 1pcs BulletPoint2 : Package Includes: QFN88 pin pitch 0.35mm | C. Test seat: QFN88-0.35 | D. BulletPoint3 : U-shaped thimble, more stable contact, long service life, mechanical service life: 10W times BulletPoint4 : E. Operating temperature: - 55 ~155 Current: 1A max BulletPoint5 : Specifications and dimensions ItemName : Wiring Connecting Terminals - eMMC Socket,11x10,Test and Burn-in Socket,for eMMC Programmer eMMC Socket Adapter Reader,BGA169 BGA153,SGL ItemTypeKeyword : dip-sockets Manufacturer : CHIKIMIKI NumberOfItems : 1 PartNumber : CNCKC2F7AA1F02CC7F7EE7790F9E2395BB39 ProductDescription : This test&burn-in single socket is a components of eMMC adapter and can be replacable. Includes size limiter: 11x10mm It's designed for the test and burn in of nand flash or matched chips. 1) Support Package includes: BGA169,BGA153 2) Support eMMC: thickness= 0.8~1.5mm, pin pitch= 0.5mm 3) Long life span: 100,000(Mechanical) 4) Support all brand eMMC,such as For Samsung, Hynix, Sandisk, For Toshiba, Intel, Kingston etc 5) Well designed to connect flat bottom, solder ball,even if no ball. This socket includes the size limiter(s) of 11x10mm. If you want other type, please open below links and add it to the cart. sa_k83yvh_fssa_k83yvh_fssa_k83yvh_fs ProductSiteLaunchDate : 2024-11-09T02:20:32.403Z UnspscCode : 39122200