Aremco-Bond 805 Epoxy for Bonding and Molding Applications, Pint

Imported from USA | Ships in 10 working days

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Product Information


Specification
Brand : ZIZEV
BulletPoint1 : Via engineering plas ic shell manufac uring,such push ransfer isDurable wi h prac ical adop abili y.
BulletPoint2 : Some insulating materials can be covered on the drawn circuit, thereby drawing a multilayer circuit. A good choice for you.
BulletPoint3 : Golden Appearance: Unique golden appearance makes the product look more fashionable. The product uses special ink coating for better conductivity.
BulletPoint4 : Properly Adhesion: conductive ink adheres nicely to usually used materials and isn't without problems washed away with water.
BulletPoint5 : digital conductive ink paint pen, far off keyboard circuit board restore tool metal powder
Color : Gold
CompatibleMaterial : Aluminum
CompatibleMaterial1 : Aluminum
CompatibleMaterial2 : Glass
CompatibleMaterial3 : Plastic
GradeRating : Commercial
ItemForm : Paste
ItemName : Aremco-Bond 805 Epoxy for Bonding and Molding Applications, Pint
ItemPackageDimensions_Height : 2 centimeters
ItemPackageDimensions_Length : 14 centimeters
ItemPackageDimensions_Width : 2 centimeters
ItemPackageQuantity : 1
ItemShape : Round
ItemTypeKeyword : conductive-adhesives
ItemVolume : 16 fluid_ounces
Manufacturer : Graphtek
Material : Aluminum
ModelNumber : ARMC-805
NumberOfItems : 1
PartNumber : 805
ProductDescription : Aremco-Bond 805 is an aluminum-filled, two-component (resin:hardener) epoxy paste for specialty bonding, molding and potting applications to 570°F (300°C). Provides low shrinkage, high thermal conductivity and excellent mechanical strength.

Aremco-Bond 805 should be mixed thoroghly in 100:12 ratio (by weight) to a uniform consistency. Requires curing for 2 hours at 100°F and then for 2 more hours at 200°F (recommended) or for 24 hours at room temperature plus 2 hours at 200°F. In most cases, the epoxy should be applied to both surfaces maintaining a glue line of less than 10 mils.

On the picture Aremco-Bond 805 bonds aluminum heat sink to a power semiconductor device.

ProductSiteLaunchDate : 2013-10-31T19:58:07.417Z
RecommendedUsesForProduct : Electrical, Arts and Craft
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
SurfaceRecommendation1 : Metal
SurfaceRecommendation2 : Glass
UnitCount : 2
UnspscCode : 31201600
WaterResistanceLevel : water_resistant

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