Cart 2 india

Specification
Brand : Epoxy International
BulletPoint1 : Appearance: Silver
BulletPoint2 : Cure Type: Heat cure or room temperature
BulletPoint3 : Benefits: High strength Perfect bond
BulletPoint4 : Mix Ratio by weight: 100:5 / Resin:Hardener
BulletPoint5 : Substrates: Excellent choice for aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards
Color : Bronze,Silver
CompatibleMaterial1 : Aluminum
CompatibleMaterial2 : Ceramic
CompatibleMaterial3 : Glass
CompatibleMaterial4 : Alloy Steel
ItemForm : Paste
ItemName : Silver-Bond 24 High Heat Resistance Silver Conductive Epoxy Adhesive Up to 190C
ItemPackageQuantity : 1
ItemTypeKeyword : conductive-adhesives
Manufacturer : Epoxy International
Material : Aluminum
NumberOfItems : 1
PartNumber : Silver-Bond 24-50
ProductDescription : Mix Ratio by weight: 100:5 / Resin:Hardener Substrates: Excellent choice for aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards Typical Application: assembly, manufacture and repair of electronic modules, printed circuits, integrated circuits, electrical contacts, capacitors, wave guides and flat cables, for high-frequency RF shielding, and for applications where a "hot" soldering iron is impractical. Mixed Viscosity: 25,000 Specific Gravity, mixed: 2.66 Reactive solids contents, %: 100 Pot Life: 1 year Shelf life: 1 year 2 hours: @ 100C 1 hour: @ 125C 24 hour: @ Room Temperature Hardness, Shore D: 85 Adhesive bond strength: 1270 psi Volume Resistivity ohm-cm: < 0.0003 CTE, linear: 27.2 in/in-F @ Temperature 68.0 F Thermal Conductivity: 1.50 W/m-K10.4 BTU-in/hr-ft-F Glass Transition Temp, Tg: 92.0 C 198 F Operating Temperature: -60 to 190 C Silver-Bond 24 High Heat Resistance Silver Conductive Epoxy Adhesive Up To 190C is a two part electrically conductive composition developed for low shrinkage; low resistivity bonding applications where good electrical and physical properties over a wide temperature range (up to 190C) are required.Silver-Bond 24 High Heat Resistance Silver Conductive Epoxy Adhesive Up To 190C is smooth paste formulation of refined pure silver and epoxy is free of solvents and copper or carbon additives. It can be used -- after REQUIRED high temperature cure cycle -- for the assembly, manufacture and repair of electronic modules, printed circuits, integrated circuits, electrical contacts, capacitors, wave guides and flat cables, for high-frequency RF shielding, and for applications where a "hot" soldering iron is impractical.When cured Silver-Bond 24 High Heat Resistance Silver Conductive Epoxy Adhesive Up To 190C is a hard, dimensionally stable, conductive material which is resistant to water, weathering, gases and vapors, lubricants, fuels, alcohol, and al
ProductSiteLaunchDate : 2016-03-28T14:22:23.871Z
UnitCount : 1
UnspscCode : 31201600
WaterResistanceLevel : water_resistant