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Specification
Brand : Epoxy International
BulletPoint1 : Appearance: Milky translucent
BulletPoint2 : Cure Type: Room temperature or Heat Cure
BulletPoint3 : Benefits: Passes NASA's Outgassing/Low Outgassing Solvent free Weather resistant
BulletPoint4 : Mix Ratio by weight: 100:22.5 / Resin:Hardener
BulletPoint5 : Substrates: Ceramics, glass to glass, fabrics, metals, laminates and other composite materials
Color : Yellow
CompatibleMaterial : Glass,industrial
CompatibleMaterial1 : Glass
CompatibleMaterial2 : Stone
CompatibleMaterial3 : Leather
CompatibleMaterial4 : Plastic
ExternallyAssignedProductIdentifier1 : 4024596009878
ExternallyAssignedProductIdentifier2 : 04024596009878
GpsrSafetyAttestation : 1
ItemForm : Liquid
ItemName : Strong-Bond 116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing
ItemPackageDimensions_Height : 18.6 centimeters
ItemPackageDimensions_Length : 3.1 centimeters
ItemPackageDimensions_Width : 3.5 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : conductive-adhesives
LiquidVolume : 1.6906742408873 fluid_ounces
Manufacturer : Epoxy International
Material : Resin
ModelName : 30577150
ModelNumber : 30577150
NumberOfItems : 1
PackageLevel : unit
PartNumber : Strong-Bond 116-250
ProductDescription : Mix Ratio by weight: 100:22.5 / Resin:Hardener Substrates: Ceramics, glass to glass, fabrics, metals, laminates and other composite materials Operating Temperature: -60 to 130 C Typical Application: critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies Specific Gravity: 1.25 Reactive solids contents, %: 100 Pot Life: 30 minutes Viscosity: 100,000 4 hours: @ 65C 24 hours: @ 25C Volume Resistivity: 6.00e+13 ohm-cm Dielectric Constant: 4.5 Dielectric Strength: 410 kV/mil Hardness, Shore D: 88 Strong-Bond 116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies.Strong-Bond 116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing is two-part, solvent-free compound is readily mixed, handled, used, and cured at room temperature, and develops strong bonds to most clean, dry material surfaces including metals, glass, ceramics, wood and many plastics.Strong-Bond 116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis.For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).1) Carefully clean and dry all surfaces to be bonded.2) Apply this completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; how
ProductSiteLaunchDate : 2016-03-28T14:22:49.952Z
SafetyDataSheetUrl : https://webdata.weicon.de/Assets/pdfs/MSDS_305770_EN_EN_.pdf
SpecificUsesForProduct1 : Food Processing
SpecificUsesForProduct2 : Biomedical Devices
SpecificUsesForProduct3 : Equipment Manufacturing
StreetDate : 2014-04-18T00:00:01Z
Style : Compact
SupplierDeclaredDgHzRegulation : not_applicable
TensileStrength : 2100 pounds_per_square_inch
UnitCount : 1.6907
UnspscCode : 31200000
Viscosity : 27000 cps
WaterResistanceLevel : waterproof