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Specification
Brand : Epoxy International
BulletPoint1 : Appearance: Tan
BulletPoint2 : Cure Type: Heat cure or Room Temperature
BulletPoint3 : Benefits: Fast cure Strong Durable High-impact bonds at room temperature
BulletPoint4 : Mix Ratio by weight: 100:23 / Resin:Hardener
BulletPoint5 : Substrates: Bonds readily to itself and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and to many other materials
Color : Amber
CompatibleMaterial : Wood,glass,packaging,plastics
CompatibleMaterial1 : Glass
CompatibleMaterial2 : Plastic
CompatibleMaterial3 : Glass
CompatibleMaterial4 : Concrete
CompatibleMaterial5 : Stone
CompatibleMaterial6 : Leather
CompatibleMaterial7 : Marble
ItemForm : Paste
ItemName : Strong-Bond 56 Staking Compound Low Thermal Expansion Encapsulation Epoxy Adhesive
ItemPackageQuantity : 1
ItemTypeKeyword : conductive-adhesives
ItemVolume : 24 fluid_ounces
Manufacturer : Epoxy International
Material : Resin
NumberOfItems : 1
PartNumber : Strong-Bond 56-250
ProductDescription : Mix Ratio by weight: 100:23 / Resin:Hardener Substrates: Bonds readily to itself and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and to many other materials Typical Applications: Fiber optic bundles, potting glas fibers and fiber optic connectors Viscosity @ 25 C: 12,000 1000 (After Mixing) @ Temperature 77.0 F, 25C Specific Gravity, mixed: 2.294 Reactive solids contents, %: 100 Pot Life: 5 minutes Shelf life: 1 Year Glass transition temperature (Tg),: -40C, 100F Lap shear strength, psi: 3400 (Alum to Alum) Operating Temperature: -40 to 100 C Cure Time: 5 minutes CTE, linear: 14.4 in/in-F@Temperature 68.0 F Thermal Conductivity: 0.840 W/m-K5.83 BTU-in/hr-ft-F 1 Hour: @ 25C 3 Hours: @ 65C 24 Hours: @ 25C Hardness, Shore D: 79 Adhesive Bond Strength: 3400 psi Strong-Bond 56 Staking Compound Low Thermal Expansion Encapsulation Epoxy Adhesive is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards.Strong-Bond 56 Staking Compound Low Thermal Expansion Encapsulation Epoxy Adhesive is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).1) Carefully clean and dry all surfaces to be bonded.2) Apply the Strong-Bond 56 Staking Compound Low Thermal Expansion Encapsulation Epoxy Adhesive completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping con
ProductSiteLaunchDate : 2016-03-28T14:23:06.043Z
SpecificUsesForProduct1 : Repair
SpecificUsesForProduct10 : Sink
SpecificUsesForProduct11 : Landscaping
SpecificUsesForProduct12 : Surgical
SpecificUsesForProduct13 : Wall Repair
SpecificUsesForProduct2 : Woodworking
SpecificUsesForProduct3 : Carpentry
SpecificUsesForProduct4 : Flooring
SpecificUsesForProduct5 : Masonry
SpecificUsesForProduct6 : Countertop
SpecificUsesForProduct7 : Casting
SpecificUsesForProduct8 : Glass
SpecificUsesForProduct9 : Furniture
UnspscCode : 31201600
WaterResistanceLevel : water_resistant