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Specification
Brand : Sinm
BulletPoint : 19mm Mouth Diameter Solder Connection Air Heat Pump Copper Filter With Screen Cooler Parts
BulletPoint1 : COMPOSITION: High-purity binary eutectic alloy consisting of 80% gold (Au) and 20% tin (Sn) for precise soldering applications
BulletPoint2 : FORM FACTOR: Pre-formed solder sheet design allows for easy handling and accurate placement during brazing operations
BulletPoint3 : APPLICATIONS: Ideal for electronic packaging, semiconductor assembly, and high-temperature soldering requirements
BulletPoint4 : MATERIAL PROPERTIES: Features excellent wetting characteristics and strong metallurgical bonding capabilities
BulletPoint5 : SPECIFICATIONS: Premium-grade brazing foil engineered for high-reliability joining processes in electronics manufacturing
Color : Metallic color
ExternallyAssignedProductIdentifier : 9344483627189
GradeRating : High Clean
ItemForm : Sn5%-Pb92.5%-Ag2.5%
ItemForm1 : Sheet
ItemForm2 : Foil
ItemName : Au-Sn Alloy Preformed Solder Sheet, Gold-Tin Alloy Solder Sheet, Au=80% Sn=20% Brazing Foil, High Clean Binary Eutectic Alloy Gold-Tin Solder Sheet (0.025 * 15 * 50mm Thickness*W*L)
ItemPackageDimensions_Height : 0.5 inches
ItemPackageDimensions_Length : 4 inches
ItemPackageDimensions_Width : 6 inches
ItemShape : Sheet
ItemTypeKeyword : solder
Manufacturer : SINM
Material : Sn5%-Pb92.5%-Ag2.5%
Material1 : Gold
Material2 : Tin
ModelNumber : 0.025*15*50mm Thickness*W*L
NumberOfItems : 1
PartNumber : SINM Au80 Sn20
ProductDescription : Experience superior bonding performance with this high-purity Au-Sn alloy solder sheet. Featuring an optimal composition of 80% gold and 20% tin, this binary eutectic alloy delivers exceptional thermal and electrical conductivity. The preformed solder sheet format allows for precise placement and consistent results in brazing applications. Perfect for high-reliability electronic assemblies, semiconductor packaging, and advanced manufacturing processes where clean, void-free joints are crucial. This premium brazing foil maintains its structural integrity at elevated temperatures and provides excellent wetting characteristics. Its uniform thickness and composition ensure repeatable results in demanding industrial applications. Ideal for specialized electronics manufacturing where high-strength, high-temperature bonds are required.
ProductSiteLaunchDate : 2025-02-21T14:35:37.099Z
SpecificationMet1 : Rohs
SpecificationMet2 : Reach
SupplierDeclaredDgHzRegulation : not_applicable
UnspscCode : 23271800