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Specification
Brand : Chip Quik
BulletPoint : Solder Bar
ExternallyAssignedProductIdentifier1 : 0708210650298
ExternallyAssignedProductIdentifier2 : 708210650298
GpsrSafetyAttestation : 1
ItemDisplayWeight : 35 grams
ItemName : Chip Quik RMA591AX10 RMA Solder Paste Sn63/Pb37 T4 (35g syringe) ROL0
ItemPackageDimensions_Height : 5 inches
ItemPackageDimensions_Length : 3 inches
ItemPackageDimensions_Width : 1 inches
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : metal
ModelNumber : RMA591AX10
PartNumber : RMA591AX10
ProductDescription : Tin/Lead RMA Solder Paste (ROL0) Specifications Alloy: Sn63/Pb37 Flux Type: Synthetic RMA Flux Classification: ROL0 Metal Content: 87% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 183C (361F) Size: 10cc/35g syringe Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2022-02-03T19:14:29.233Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/RMA591AX10.pdf
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 8
UnspscCode : 23271800