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Specification
Brand : Chip Quik
ExternallyAssignedProductIdentifier1 : 700254126500
ExternallyAssignedProductIdentifier2 : 0700254126500
ItemName : Chip Quik SMD291AX10T4 Solder Paste no clean 63Sn/37Pb in 10cc syringe 35g (T4)
ItemPackageDimensions_Height : 11 centimeters
ItemPackageDimensions_Length : 2 centimeters
ItemPackageDimensions_Width : 6.6 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : Metal
ModelNumber : SMD291AX10T4
PartNumber : SMD291AX10T4
ProductDescription : Description Solder Paste no clean 63Sn/37Pb in 10cc syringe 35g, w/plunger & tip, T4 mesh. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 183C (361F) Size: 10cc/35g syringe Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2017-12-07T08:00:00.000Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/smd291ax10t4.pdf
SupplierDeclaredDgHzRegulation : not_applicable