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Specification
Brand : Chip Quik
BulletPoint : Flux-Cored Solder Wire, Water-Soluble, Lead-Free, Sn99.3 (K100LD), 3.3%, 0.020'
BulletPoint1 : FUNCTON : This solder mask ink can be used for insulation and of PCB electronic components , It can also fix the wire in place and prevent wire breakage
BulletPoint2 : EASY TO USE : Expose this ink toLight or sunlight after applying it to PCB , and it will solidify gradually , easy to use
BulletPoint3 : APPLICATION : Meet your basic needs , soldering kitis for mobile phones , laptops , gaming consoles BGA PCB , and other electronic product repairs
BulletPoint4 : TO FLOWED : You can cut down the corresponding part of stencils of the BGA chip , soldering kit is excellentto flowed soldering alloys
BulletPoint5 : AND PRACTICAL : The solder mask ink is made of material , and practical to use , soldering kit is Best for BGA SMD SMT Repairs
Color : Silver Tone
ConnectorType : USB Type A
ExternallyAssignedProductIdentifier : 7627421404281
ExternallyAssignedProductIdentifier1 : 700254126883
ExternallyAssignedProductIdentifier2 : 0700254126883
FinishType : Silver
Hazmat : auto-grounding
ItemName : Chip Quik SMD291AX250T4 Solder Paste in jar 250g (T4) Sn63/Pb37 no clean
ItemPackageDimensions_Height : 5.6896 centimeters
ItemPackageDimensions_Length : 5.3086 centimeters
ItemPackageDimensions_Width : 5.5118 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : Solder Paste
ModelName : 24-9574-6401
ModelNumber : SMD291AX250T4
NumberOfBoxes : 1
NumberOfItems : 10
NumberOfPorts : 1
PartNumber : SMD291AX250T4
ProductDescription : Description Solder Paste in jar 250g (T4) Sn63/Pb37 no clean 90.25% metal. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 183C (361F) Size: 250g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2017-12-07T21:06:40.612Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/SMD291AX250T4.pdf
SpecificUsesForProduct : personal
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 10
UnspscCode : 23271800