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Product Information
Specification
Brand : Chip Quik
BulletPoint : Solder Paste
BulletPoint1 : Country Of Origin: United States
BulletPoint2 : Model Number: 24-6337-0061
BulletPoint3 : Item Package Dimension: 2.399999997552" L x 2.299999997654" W x 2.299999997654" H
ExternallyAssignedProductIdentifier1 : 0700254126876
ExternallyAssignedProductIdentifier2 : 700254126876
GpsrSafetyAttestation : 1
ItemName : Chip Quik SMD291AX500T5 Solder Paste in jar 500g (T5) Sn63/Pb37 no clean
ItemPackageDimensions_Height : 2.75 inches
ItemPackageDimensions_Length : 2.5 inches
ItemPackageDimensions_Width : 2.5 inches
ItemPackageQuantity : 5
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : lead
ModelNumber : SMD2055
PartNumber : SMD291AX500T5
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description BGA Solder Spheres .025" (0.63mm) diameter 250K Bottle. SAC 305 Lead-Free. Specifications Alloy: Sn96.5/Ag3.0/Cu0.5 Sphere Diameter: 0.025" (0.63mm) Melting Point: 217-220C (423-428F) Size: 250,000 (Counted by weight) Shelf Life >24 months Transportation This product has no shipping restrictions.
ProductSiteLaunchDate : 2017-12-07T21:06:39.923Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/SMD291AX500T5.pdf
SupplierDeclaredDgHzRegulation : not_applicable
UnspscCode : 23271800
