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Specification
Brand : Chip Quik
BulletPoint1 : Chip Quik SMD291AX50T3 Solder Paste: Contains 50g of solder paste for SMD components
BulletPoint2 : Made with Sn63/Pb37 alloy: Provides reliable electrical and thermal conductivity
BulletPoint3 : No clean required: Saves time and effort in the soldering process
BulletPoint4 : Compatible with most SMD components: Suitable for use in electronic devices
BulletPoint5 : Made by Chip Quik: A trusted brand in electronics soldering and repair
Color : silver
CompatibleMaterial : Metal
CustomerPackageType : Standard Packaging
ExternallyAssignedProductIdentifier1 : 700254127156
ExternallyAssignedProductIdentifier2 : 0700254127156
FcShelfLife : 900 days
Hazmat1 : SOLIDS CONTAINING FLAMMABLE LIQUID, N.O.S.
Hazmat10 : CN_NoAir
Hazmat11 : DE_NoAir
Hazmat12 : EG_NoAir
Hazmat13 : ES_NoAir
Hazmat14 : FR_NoAir
Hazmat15 : GB_NoAir
Hazmat16 : IN_NoAir
Hazmat17 : IT_NoAir
Hazmat18 : JP_NoAir
Hazmat19 : MX_NoAir
Hazmat2 : UN3175
Hazmat20 : NL_NoAir
Hazmat21 : PL_NoAir
Hazmat22 : SA_NoAir
Hazmat23 : SE_NoAir
Hazmat24 : SG_NoAir
Hazmat25 : TR_NoAir
Hazmat26 : US_NoAir
Hazmat27 : ZA_NoAir
Hazmat3 : II
Hazmat4 : 4.1
Hazmat5 : AE_NoAir
Hazmat6 : AU_NoAir
Hazmat7 : BE_NoAir
Hazmat8 : BR_NoAir
Hazmat9 : CA_NoAir
IsExpirationDatedProduct : 1
ItemForm : Paste
ItemName : Chip Quik SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37 no clean
ItemPackageDimensions_Height : 5.1054 centimeters
ItemPackageDimensions_Length : 3.4036 centimeters
ItemPackageDimensions_Width : 4.8006 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
ItemVolume : 50 milliliters
Manufacturer : Chip Quik®
Material : Metal
ModelNumber : SMD291AX50T3
PartNumber : SMD291AX50T3
ProductDescription : Description Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 183C (361F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2017-12-07T21:06:40.276Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/SMD291AX50T3.pdf
SpecificUsesForProduct : Electronics Soldering and Repair
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1.76
UnspscCode : 23271800
WaterResistanceLevel : not_water_resistant