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Specification
Brand : Chip Quik
BulletPoint : Solder Paste
BulletPoint1 : Country Of Origin: United States
BulletPoint2 : Model Number: 24-6337-0061
BulletPoint3 : Item Package Dimension: 2.399999997552" L x 2.299999997654" W x 2.299999997654" H
ExternallyAssignedProductIdentifier1 : 0700254126951
ExternallyAssignedProductIdentifier2 : 700254126951
ItemName : Chip Quik SMD291SNL500T5 Solder Paste in jar 500g (T5) SAC305 no clean
ItemPackageDimensions_Height : 2.75 inches
ItemPackageDimensions_Length : 2.5 inches
ItemPackageDimensions_Width : 2.5 inches
ItemPackageQuantity : 5
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : metal
PartNumber : SMD291SNL500T5
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Solder Paste in jar 500g (T5) SAC305 no clean 88% metal. Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88% metal by weight. Particle Size: T5 (15-25 microns) Melting Point: 217-220C (423-428F) Size: 500g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2017-12-07T21:06:44.756Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/SMD291SNL500T5.pdf
SupplierDeclaredDgHzRegulation : not_applicable
UnspscCode : 23271800