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Specification
Brand : Chip Quik
BulletPoint : Solder Wire
ExternallyAssignedProductIdentifier1 : 0708210645966
ExternallyAssignedProductIdentifier2 : 708210645966
GpsrSafetyAttestation : 1
ItemName : Chip Quik SMD2SW.031 4OZ Solder Wire 60/40 Tin/Lead No-Clean Water-Washable .031 4oz
ItemPackageDimensions_Height : 7.2136 centimeters
ItemPackageDimensions_Length : 3.5052 centimeters
ItemPackageDimensions_Width : 5.9944 centimeters
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : lead
ModelNumber : SMD2SW.031 4OZ
PartNumber : SMD2SW.031 4OZ
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Solder Paste in jar 250g (T4) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F. Alloy: Sn42/Bi57.6/Ag0.4 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 138C (281F) Size: 250g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2021-06-02T13:14:30.632Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/SMD2SW.031 4OZ.pdf
SupplierDeclaredDgHzRegulation : not_applicable
UnspscCode : 23271800