Chip Quik SMDLTLFP10T4 Solder Paste no clean Sn42/Bi57.6/Ag0.4 Low Temp 138C in 10cc syringe 35g (T4)

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Product Information


Specification
Brand : Chip Quik
BulletPoint : Solder Paste
BulletPoint1 : The main component ofTS-308 is 18Cr-8Ni, widely used in austenitic stainless steel welding materials.
BulletPoint2 : Can be used AC and DC power supply, all-position welding. Excellent welding performance - arc stability, beautiful appearance, ripple delicate, very little splash, slag easy
BulletPoint3 : Good chemical resistance of the coating, the mechanical properties of deposited metal stability, X-Ray high pass rate.
BulletPoint4 : Ideal for repairs and maintenance.
BulletPoint5 : The materials have been strictly screened and the quality is higher than that of products of the same level.
ExternallyAssignedProductIdentifier : 7612792086754
ExternallyAssignedProductIdentifier1 : 700254126623
ExternallyAssignedProductIdentifier2 : 0700254126623
GpsrSafetyAttestation : 1
IncludedComponents : Paste mixer ×1, 500g clump weight ×1, The belt ×2, The fuse ×1, Lining ×2
ItemName : Chip Quik SMDLTLFP10T4 Solder Paste no clean Sn42/Bi57.6/Ag0.4 Low Temp 138C in 10cc syringe 35g (T4)
ItemPackageDimensions_Height : 10.1092 centimeters
ItemPackageDimensions_Length : 2.5908 centimeters
ItemPackageDimensions_Width : 6.2992 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : lead
ModelNumber : SMDLTLFP10T4
NumberOfItems : 1
PartNumber : SMDLTLFP10T4
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Solder Paste Lead-Free Sn42/Bi57.6/Ag0.4 Low Temperature T4 mesh 10cc Syringe. Alloy: Sn42/Bi57.6/Ag0.4 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 87% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 138C (281F) Size: 10cc/35g syringe Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2017-12-07T21:06:28.556Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/SMDLTLFP10T4.pdf
Size : 2.0mm 10pcs
Style : Petro
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 10
UnspscCode : 23271800

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