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Specification
Brand : Chip Quik
BulletPoint1 : ¡¾Features¡¿Environmentally friendly ?, refined materials, strengthened solder ball soldering capabilities.
BulletPoint2 : ¡¾Performance¡¿Ultra?small ball?shaped tin electronic parts, which can transmit electronic .
BulletPoint3 : ¡¾Description¡¿The diameter of the solder ball with IC packaging is approx. 0.2?0.76mm/0.008?0.03in.
BulletPoint4 : ¡¾Professional design¡¿Trace elements added to the solder balls to improve the oxidation ability and reliability of the solder balls.
BulletPoint5 : ¡¾Widely Used¡¿ Widely used in connecting semiconductor chips, circuit templates, PCB boards, and transmit electronic .
ExternallyAssignedProductIdentifier1 : 0708210651400
ExternallyAssignedProductIdentifier2 : 708210651400
FinishType : Finish
Hazmat : auto-grounding
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ItemName : Chip Quik SMDSWLT.047 1OZ Sn42/Bi57/Ag1 .047" Solder Wire 1oz Spool
ItemPackageDimensions_Height : 1 inches
ItemPackageDimensions_Length : 3 inches
ItemPackageDimensions_Width : 3 inches
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik
Material : Solder Wire
Material1 : Material
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Material5 : Material
ModelNumber : SMDSWLT.047 1OZ
PartNumber : SMDSWLT.047 1OZ
PowerSourceType : PowerSource
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Low-Temp Lead-Free Solder Wire. PRODUCT HIGHLIGHTS - LOW TEMPERATURE melts at 138C - Solid Core Wire. - RoHS 3 and REACH Compliant. SPECIFICATIONS Alloy: Sn42/Bi57/Ag1 Diameter: 0.047" (1.2mm) Melting Point: 138C (281F) Packaging: 1oz Spool Please Note: Although Sn42/Bi57/Ag1 forms strong joints and is more ductile due to the added 1% Silver, in wire form it is brittle and needs to be handled gently when unspooling. It is normal for spooled Sn42/Bi57/Ag1 wire to have some breaks in it.
ProductSiteLaunchDate : 2021-02-04T21:17:43.862Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/SMDSWLT.047 1OZ.pdf
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1