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Specification
Brand : Chip Quik
BulletPoint : Solder Paste
ExternallyAssignedProductIdentifier1 : 0700254126739
ExternallyAssignedProductIdentifier2 : 700254126739
ItemName : Chip Quik TS391LT10 Thermally Stable Solder Paste No-Clean Sn42/Bi57.6/Ag0.4 T4 (35g syringe)
ItemPackageDimensions_Height : 12.6 centimeters
ItemPackageDimensions_Length : 2.5 centimeters
ItemPackageDimensions_Width : 6.2 centimeters
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : lead
ModelNumber : TS391LT10
PartNumber : TS391LT10
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik TS [Thermally Stable] Solder Paste No-Clean Lead-Free Sn/Bi/Ag in 10cc syringe 35g w/plunger & tip. Revolutionary Formula: No Refrigeration Required! Alloy: Sn42/Bi57.6/Ag0.4 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 87% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 138C (281F) Size: 10cc/35g syringe Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >12 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2017-12-07T21:06:34.313Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/TS391LT10.pdf
SupplierDeclaredDgHzRegulation : not_applicable
UnspscCode : 23271800