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Specification
Brand : Chip Quik
BulletPoint : Grote
BulletPoint1 : Performance-Ultra?small ball?shaped tin electronic parts, which can transmit electronic .
BulletPoint2 : Widely Used- Widely used in connecting semiconductor chips, circuit templates, PCB boards, and transmit electronic .
BulletPoint3 : Features-Environmentally friendly ?, refined materials, strengthened solder ball soldering capabilities.
BulletPoint4 : Description-The diameter of the solder ball with IC packaging is approx. 0.2?0.76mm/0.008?0.03in.
BulletPoint5 : Professional design-Trace elements added to the solder balls to improve the oxidation ability and reliability of the solder balls.
Color : Green (Lead-free)
ExternallyAssignedProductIdentifier : 6018006970917
ExternallyAssignedProductIdentifier1 : 0708210652520
ExternallyAssignedProductIdentifier2 : 708210652520
ExternallyAssignedProductIdentifier3 : 00037103325754
FinishType : Finish
GpsrSafetyAttestation : 1
IncludedComponents : Weller Ph 70 Safety Rest Weller Packed
IncludedComponents1 : inc
IncludedComponents2 : inc
IncludedComponents3 : inc
IncludedComponents4 : inc
IncludedComponents5 : inc
IncludedComponents6 : inc
IncludedComponents7 : inc
IncludedComponents8 : inc
IncludedComponents9 : inc
ItemName : Chip Quik TS991AX500T4 Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (500g jar)
ItemPackageDimensions_Height : 3 inches
ItemPackageDimensions_Length : 3 inches
ItemPackageDimensions_Width : 3 inches
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik
Material : Solder Paste
Material1 : Material
Material2 : Material
Material3 : Material
Material4 : Material
Material5 : Material
ModelName : Weller Ph 70 Safety Rest Weller Packed
ModelNumber : REM32
NumberOfChannels : 1
NumberOfItems : 1
NumberOfPieces : 25
PartNumber : TS991AX500T4
PartTypeId : 17380
PowerSourceType : PowerSource
ProductDescription : Description Chip Quik 991 Series Thermally Stable Solder Paste No-Clean Sn/Pb in 500g jar. Revolutionary Formula: No Refrigeration Required! Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 183C (361F) Size: 500g jar Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2021-02-04T16:38:05.930Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/TS991AX500T4.pdf
Size : Thrее Расk
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1
UnspscCode : 23271800