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Specification
Brand : Chip Quik
BulletPoint : Solder Paste
BulletPoint1 : The main component ofTS-308 is 18Cr-8Ni, widely used in austenitic stainless steel welding materials.
BulletPoint2 : Can be used AC and DC power supply, all-position welding. Excellent welding performance - arc stability, beautiful appearance, ripple delicate, very little splash, slag easy
BulletPoint3 : Good chemical resistance of the coating, the mechanical properties of deposited metal stability, X-Ray high pass rate.
BulletPoint4 : Ideal for repairs and maintenance.
BulletPoint5 : The materials have been strictly screened and the quality is higher than that of products of the same level.
ExternallyAssignedProductIdentifier : 7612792086754
ExternallyAssignedProductIdentifier1 : 0708210653091
ExternallyAssignedProductIdentifier2 : 708210653091
GpsrSafetyAttestation : 1
IncludedComponents : Paste mixer ×1, 500g clump weight ×1, The belt ×2, The fuse ×1, Lining ×2
ItemName : Chip Quik TS991SNL35T4 Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (35g syringe)
ItemPackageDimensions_Height : 10.0076 centimeters
ItemPackageDimensions_Length : 2.8956 centimeters
ItemPackageDimensions_Width : 5.207 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : lead
ModelNumber : TS991SNL35T4
NumberOfItems : 1
PartNumber : TS991SNL35T4
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik 991 Series Thermally Stable Solder Paste No-Clean Lead-Free SAC305 in 35g/10cc syringe with plunger and tips. Revolutionary Formula: No Refrigeration Required! Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 87% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 217C (423F) Size: 35g/10cc syringe Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2021-06-02T12:12:35.847Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/TS991SNL35T4.pdf
Size : 2.0mm 10pcs
Style : Petro
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 10
UnspscCode : 23271800