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Specification
Brand : Chip Quik
BulletPoint1 : Excellent Mechanical Properties: SAC305 Provides strong solder joints that can withstand thermal and mechanical stress. Good Thermal and Electrical Conductivity: Ensures efficient performance in electronic applications. Resistance to Thermal Cycling: Performs well under conditions of temperature fluctuations.
BulletPoint2 : Alloy Composition: Made of 96.5% Tin (Sn), 3% Silver (Ag) and 0.5% Copper (Cu), this alloy combines strength with good thermal cycling capabilities
BulletPoint3 : Classic LF temperature points: melting approximately at 219ºC and solidifying around 217ºC, this wire is nearly eutectic responding well to the most lead-free temperature profiles. (*LIQ and SOL temperature range as per IPC J-STD-006B)
BulletPoint4 : No-Clean Flux Core: Contains 2.5% rosin-based no-clean flux core for excellent wetting, minimal residue, and ease of use, ensuring clean and efficient soldering.
BulletPoint5 : Certified Compliance: Meets IPC J-STD-006B standards for quality and performance, making it a preferred choice for lead-free soldering in medical devices and automotive industries, lead-free electronics assembly and repair. Convenient small spools for quick practical use.
ExternallyAssignedProductIdentifier1 : 0708210652551
ExternallyAssignedProductIdentifier2 : 708210652551
ItemName : Chip Quik TS991SNL500T4 Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar)
ItemPackageDimensions_Height : 6.9596 centimeters
ItemPackageDimensions_Length : 6.604 centimeters
ItemPackageDimensions_Width : 6.7056 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik
Material : Solder Paste
PackageLevel : unit
PartNumber : TS991SNL500T4
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik 991 Series Thermally Stable Solder Paste No-Clean Lead-Free SAC305 in 500g jar. Revolutionary Formula: No Refrigeration Required! Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88.5% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 217C (423F) Size: 500g jar Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2021-02-04T19:31:25.256Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/TS991SNL500T4.pdf
Size : 0.25 mm / 0.010"
Style : No-clean Core
SupplierDeclaredDgHzRegulation : not_applicable
UnspscCode : 23271800