Cart 2 india

Specification
Brand : Harris
BulletPoint1 : 1 Troy Once (31 g), 1/16" Thick
BulletPoint2 : 56% Silver, 22% Copper
BulletPoint3 : 17% Zinc, 5% Tin
BulletPoint4 : Cadmium free
BulletPoint5 : Material Type: silver, copper, zinc, tin
Color : silver
CompatibleMaterial : Metal
CustomerPackageType : Standard Packaging
ExternallyAssignedProductIdentifier1 : 688940429831
ExternallyAssignedProductIdentifier2 : 0688940429831
ExternallyAssignedProductIdentifier3 : 00688940429831
FcShelfLife : 900 days
Hazmat1 : SOLIDS CONTAINING FLAMMABLE LIQUID, N.O.S.
Hazmat10 : CN_NoAir
Hazmat11 : DE_NoAir
Hazmat12 : EG_NoAir
Hazmat13 : ES_NoAir
Hazmat14 : FR_NoAir
Hazmat15 : GB_NoAir
Hazmat16 : IN_NoAir
Hazmat17 : IT_NoAir
Hazmat18 : JP_NoAir
Hazmat19 : MX_NoAir
Hazmat2 : UN3175
Hazmat20 : NL_NoAir
Hazmat21 : PL_NoAir
Hazmat22 : SA_NoAir
Hazmat23 : SE_NoAir
Hazmat24 : SG_NoAir
Hazmat25 : TR_NoAir
Hazmat26 : US_NoAir
Hazmat27 : ZA_NoAir
Hazmat3 : II
Hazmat4 : 4.1
Hazmat5 : AE_NoAir
Hazmat6 : AU_NoAir
Hazmat7 : BE_NoAir
Hazmat8 : BR_NoAir
Hazmat9 : CA_NoAir
IncludedComponents : 75310 5631 - 1 Troy Ounce
IsExpirationDatedProduct : 1
ItemForm : Paste
ItemName : Harris Safety-Silv 56% 1/16 Silver Solder Brazing Alloy 1 Troy Ounce, 75310 5631
ItemPackageDimensions_Height : 7.0104 centimeters
ItemPackageDimensions_Length : 1.905 centimeters
ItemPackageDimensions_Width : 6.8072 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
ItemVolume : 50 milliliters
Manufacturer : Harris
Material : silver, copper, zinc, tin
ModelName : 75310 5631 - 1 Troy Ounce
ModelNumber : 75310 5631 - 1 Troy Ounce
NumberOfBoxes : 1
PartNumber : 75310 5631
ProductDescription : Description Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 183C (361F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2017-05-03T21:01:57.615Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/SMD291AX50T3.pdf
SpecificUsesForProduct : Electronics Soldering and Repair
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1
UnspscCode : 23271800
WaterResistanceLevel : not_water_resistant