Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G)

Customer rating 4.9 stars

Imported from USA | Ships in 10 working days

5% additional discount on UPI | Cash On Delivery available

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₹6290 -30% ₹4400/-

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Product Information


Specification
Brand : Essmetuin
BulletPoint1 : Essmetuin SAC305 Solder Paste Content: Alloy Tin 96.5%Ag3%Cu0.5%, Solder Flux Content: 10.8%
BulletPoint2 : Lead-Free Solder Paste -High-Temperature Solder Paste With Flux, Melting Point: 217 ℃ (422.6.4F)
BulletPoint3 : Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During Welding
BulletPoint4 : Widely Used In BGA /SMD Circuit Board,Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment, Sensors, Wires, Fuses, Phone, Metal Shells, Motors, Lighting, Connectors, SMT Maintenance
BulletPoint5 : High thermal conductivity and conductivity.The Post Soldering Transparent Residues Are Non-Conductive, Non-Corrosive And Highly Insulated
Color : Grey
CustomerPackageType : Standard Packaging
ExternallyAssignedProductIdentifier1 : 779008489529
ExternallyAssignedProductIdentifier2 : 0779008489529
ExternallyAssignedProductIdentifier3 : 00779008489529
GpsrSafetyAttestation : 1
IncludedComponents : SAC305 Solder Paste
ItemDisplayWeight : 30 grams
ItemName : Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G)
ItemPackageDimensions_Height : 17.0942 centimeters
ItemPackageDimensions_Length : 1.905 centimeters
ItemPackageDimensions_Width : 9.398 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : ZHUOBAO
Material : lead
ModelName : Essmetuin Solder Paste
ModelNumber : SAC305
NumberOfBoxes : 1
NumberOfItems : 1
PackageLevel : unit
PartNumber : 4895-227G
PowerSourceType : fuel_powered
ProductDescription : Essmetuin SAC305 Sn96.5Ag3.0Cu0.5 Melting Point 217℃ Tin Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA /SMD CPU Repairing(30G )
ProductSiteLaunchDate : 2023-02-19T15:49:55.826Z
SafetyDataSheetUrl : https://www.mgchemicals.com/downloads/msds/01%20English%20Can-USA%20SDS/sds-4890-4898.pdf
Size : Sn96.5Ag3.0Cu0.5
SkipOffer : 1
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
TargetAudienceKeyword1 : jewelry makers
TargetAudienceKeyword2 : jewelry repair
TargetAudienceKeyword3 : jewelry silver soldering
UnitCount : 1
UnspscCode : 23271800

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Top-notch quality, canÕt complain.

Five stars all the way.

Flawless in both function and design.

Awesome product and great experience.

Stunning design and excellent performance.

Extremely satisfied with the product.

IÕd consider buying again.

Awesome product and great experience.

Impressive quality and durability.

Impressive quality and durability.

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