Cart 2 india

Specification
Brand : SASKATE
BulletPoint1 : FOR BGA PLANTING: Low temperature tin paste, used for BGA tin planting when repairing electronic products such as mobile phones and computers.
BulletPoint2 : FOR CHIP WELDING: Tin paste can also be used for home appliance chip patch welding and electronic production line welding, with good practicability.
BulletPoint3 : EXCELLENT TIN: Using excellent tin material, tin paste is suitable for products that are not to high temperature, low energy consumption.
BulletPoint4 : HIGH PERFORMANCE: The solder joints are white and full, without false soldering, and have a strong reconciliation force with the soldering iron tip.
BulletPoint5 : HIGH EFFICIENCY: Using this low temperature tin paste instead of artificial soldering greatly improves the welding efficiency and has good wettability.
Color : One Color
ExternallyAssignedProductIdentifier : 7676320140455
ExternallyAssignedProductIdentifier1 : 0024924151174
ExternallyAssignedProductIdentifier2 : 024924151174
IncludedComponents : Perma Flux, Self Cleaning Soldering Flux, 16 Ounces
ItemName : Low Temperature Tin Paste, SMD Chip BGA Balling Tin Soldering Paste with Excellent Wettability, Good Practicability for Mobile Phones, Computers
ItemPackageDimensions_Height : 4 centimeters
ItemPackageDimensions_Length : 12 centimeters
ItemPackageDimensions_Width : 6 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : SASKATE
Material : Ammoniac (CAS# 12125-02-9), Zinc Chloride (CAS#7646-85-7)
ModelName : SASKATEin29xr41e8
ModelNumber : SASKATEin29xr41e8
NumberOfBoxes : 1
NumberOfItems : 1
PartNumber : SASKATEin29xr41e8
ProductDescription : Specification:
Item Type: Low Temperature Tin Paste
Material: Tin

PackageList:
1 x Tin Paste

Note:
Do not store below 0℃, as thawing will compromise the rheological properties of the solder paste.
ProductSiteLaunchDate : 2025-02-20T02:30:16.147Z
Size : Tin
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 16
UnspscCode : 23271800