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Specification
Brand : ViaGasaFamido
BulletPoint1 : Extensive Usage: Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic with ultrasmall ball tin electronic parts, etc.
BulletPoint2 : Description: The tin ball is mainly connected with the semiconductor chip, the circuit template and the PCB board, and the ultra-small ball-type tin electronic part that transmits the electronic .
BulletPoint3 : Practical Tool: Small size, easy to carry and store, convenient to use and with good performance, 250 thousand grains, a large number, can meet your use and replacement needs, very practically.
BulletPoint4 : Premium Quality: The solder with tin balls is more and can help you solder effectively. Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit.
BulletPoint5 : Features: Add trace elements to improve the oxidation ability and reliability of the solder ball pit. Tin Ball Diameter for IC Packaging: Approx. 0.2 ~ 0.76mm / 0.01 ~ 0.03in.
Color : 12v 60℃
ExternallyAssignedProductIdentifier : 7675547104578
ExternallyAssignedProductIdentifier1 : 0706919993746
ExternallyAssignedProductIdentifier2 : 706919993746
FinishType : Polished
FinishType1 : Finish
FinishType2 : Finish
FinishType3 : Finish
FinishType4 : Finish
FinishType5 : Finish
IncludedComponents1 : inc
IncludedComponents2 : inc
IncludedComponents3 : inc
IncludedComponents4 : inc
IncludedComponents5 : inc
ItemForm : Coil
ItemName : Solder Balls BGA Reballing 0.45mm 250 Thousand Grains Soldering Accessories for Chip Planting Laptop Phone Repair
ItemPackageDimensions_Height : 4 centimeters
ItemPackageDimensions_Length : 7 centimeters
ItemPackageDimensions_Width : 4 centimeters
ItemPackageQuantity : 1
ItemShape : Round Rod
ItemTypeKeyword : solder
Manufacturer : ViaGasaFamido
Material : copper
ModelNumber : WS991LT500T4
NumberOfItems : 1
PartNumber : ViaGasaFamido5q82xow0ib1340
PowerSourceType : PowerSource
ProductDescription : Specification:
Item Type: Solder Balls
Product Composition: Sn63(tin 63%)
Specification: Approx.0.45mm / 0.02in 250,000 grains
Uses: Chip planting beads, ball planting
Scope of Application: BGA package soldering, filling, maintenance, ball planting
Features: Add trace elements to improve the oxidation ability and reliability of the solder ball pit.
Tin Ball Diameter for IC Packaging: Approx. 0.2 ~ 0.76mm / 0.01 ~ 0.03in

Package List:
1 Bottle Solder Balls



ProductSiteLaunchDate : 2023-12-23T00:00:00.000Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/WS991LT500T4.pdf
Size : SFD 2015 2.0mm
Style : Manual
SupplierDeclaredDgHzRegulation : not_applicable
UnspscCode : 23271800