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Specification
Brand : COMPUTERSYSTEMS REPAIR SERVICES DATA RECOVERY
BulletPoint1 : CS-FLUX when heated at around 150 degrees (Celsius) turns into liquid and covers the small gap between the BGA component and the PCB completely. This way all solder balls are covered with CS-FLUX and during reflow or removal of the BGA components all PCB and component pads and balls are protected from oxidation.
BulletPoint2 : CS-FLUX is no clean flux and causes no corrosion if not cleaned, but if needed it can be cleaned very easily with alcohol. It causes no corossion on the PCB or components.
BulletPoint3 : Thanks to its liquid nature, a very small amount of CS-FLUX is needed for each repair resulting in a much cleaner work environment. CS-FLUX is Lead Free and halogen free and produces the minimum amount of fume .
BulletPoint4 : CS-FLUX is very sticky and specially designed to keep the solder balls inside the stencil during the reballing process. It is also ideal for reflow of BGA components (with heat gun) when needed equipment for reballing is not available. Due to its liquid nature is perfect for micro soldering even for not experienced technicians.
BulletPoint5 : CS-FLUX is produced in EU (Greece). We keep stock all around the world so that it can be shipped to you very fast.
Color : No Color
ContainsLiquidContents : 1
ExternallyAssignedProductIdentifier1 : 036336291492
ExternallyAssignedProductIdentifier2 : 0036336291492
ExternallyAssignedProductIdentifier3 : 00032277381254
GpsrSafetyAttestation : 1
Hazmat1 : ZINC CHLORIDE SOLUTION
Hazmat10 : CN_GroundOnly
Hazmat11 : DE_LimitedQuantity
Hazmat12 : EG_LimitedQuantity
Hazmat13 : ES_LimitedQuantity
Hazmat14 : FR_LimitedQuantity
Hazmat15 : GB_LimitedQuantity
Hazmat16 : IE_LimitedQuantity
Hazmat17 : IN_GroundOnly
Hazmat18 : IT_LimitedQuantity
Hazmat19 : JP_GroundOnly
Hazmat2 : UN1840
Hazmat20 : MX_LimitedQuantity
Hazmat21 : NL_LimitedQuantity
Hazmat22 : PL_LimitedQuantity
Hazmat23 : SA_LimitedQuantity
Hazmat24 : SE_LimitedQuantity
Hazmat25 : SG_LimitedQuantity
Hazmat26 : TR_LimitedQuantity
Hazmat27 : US_ORMD
Hazmat28 : ZA_LimitedQuantity
Hazmat3 : III
Hazmat4 : 8
Hazmat5 : AE_LimitedQuantity
Hazmat6 : AU_LimitedQuantity
Hazmat7 : BE_LimitedQuantity
Hazmat8 : BR_LimitedQuantity
Hazmat9 : CA_LimitedQuantity
IncludedComponents : soldering flux
Ingredients : Forney 38125 Soldering Flux Paste 2oz.
IsLiquidDoubleSealed : 1
ItemDisplayVolume : 5.027500046875 centiliters
ItemForm : Paste
ItemName : CS-Flux 10g (2x5g) Low Viscosity Halogen Free Liquid Flux for BGA Component Rework Reballing Reflow Ideal for VGA GPU Repairs and Microsoldering, CSGR
ItemPackageDimensions_Height : 17.2 centimeters
ItemPackageDimensions_Length : 1.9 centimeters
ItemPackageDimensions_Width : 5.1 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder-flux
ItemVolume : 2 fluid_ounces
LiquidContentsDescription : Paste
LiquidVolume : 0.048 kilograms
Manufacturer : COMPUTERSYSTEMS REPAIR SERVICES DATA RECOVERY
Material : copper
ModelName : 38125
ModelNumber : cs flux 2x5
NumberOfBoxes : 1
NumberOfItems : 1
PackageLevel : unit
PartNumber : cs flux 2x5
PowerSourceType : fuel_powered
ProductDescription :

CS FLUX is flux designed for BGA reballing, rework and reflow. Also appropriate for micro soldering. CS-FLUX is a low viscosity flux designed by Computer Systems research team to cover the special needs in flux usage on soldering repairs of commercial electronics such as laptops, gaming consoles etc.

Packet contains: 2 syringe X 5g (10g in total) of CS-FLUX

2 X 1.6mm tips for easy application

1 X container box where the product should be stored

No expiration date. Protect from heat and sun light. For long term storage it is suggested to be kept in fridge. Made in Greece (European Union), CSGR

ProductSiteLaunchDate : 2021-03-11T11:55:50.510Z
Scent : Unscented
Size : 1.7 Ounce (Pack of 1)
SpecificUsesForProduct : Industrial Machinery
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
SurfaceRecommendation : Glass
UnitCount : 1.7
UnspscCode : 23271808