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Specification
Brand : WnewTools
BulletPoint1 : NC-559-ASM TPF Flux Anti-Wet No-Clean 100g Cream AMTECH Solder Paste
BulletPoint2 : NC-559 as a leave-in help paste residue color is very light, there is a very value of SIR.
BulletPoint3 : Recommended for BGA, CSP and other solder ball array repair and fill the ball.
BulletPoint4 : When using smoke less, no residue. Affordable.
BulletPoint5 : Suitable for :North and south bridge, cards, cell phone chip, video chip BGA solder, bumping.
Color : Very Light
ExternallyAssignedProductIdentifier1 : 0769902874910
ExternallyAssignedProductIdentifier2 : 769902874910
Hazmat1 : CORROSIVE LIQUID, N.O.S., CORROSIVE LIQUIDS, N.O.S.
Hazmat10 : DE_LimitedQuantity
Hazmat11 : EG_LimitedQuantity
Hazmat12 : ES_LimitedQuantity
Hazmat13 : FR_LimitedQuantity
Hazmat14 : GB_LimitedQuantity
Hazmat15 : IN_GroundOnly
Hazmat16 : IT_LimitedQuantity
Hazmat17 : JP_GroundOnly
Hazmat18 : MX_LimitedQuantity
Hazmat19 : NL_LimitedQuantity
Hazmat2 : UN1760
Hazmat20 : PL_LimitedQuantity
Hazmat21 : SA_LimitedQuantity
Hazmat22 : SE_LimitedQuantity
Hazmat23 : SG_LimitedQuantity
Hazmat24 : TR_LimitedQuantity
Hazmat25 : US_ORMD
Hazmat3 : II
Hazmat4 : 8
Hazmat5 : AE_LimitedQuantity
Hazmat6 : AU_LimitedQuantity
Hazmat7 : BR_LimitedQuantity
Hazmat8 : CA_LimitedQuantity
Hazmat9 : CN_GroundOnly
ItemName : NC-559-ASM TPF Solder Flux Anti-Wet No-Clean 100g Cream AMTECH Solder Flux
ItemPackageDimensions_Height : 5 centimeters
ItemPackageDimensions_Length : 12 centimeters
ItemPackageDimensions_Width : 8 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder-flux
Manufacturer : Wnew
Material : tin
ModelName : Solder paste
ModelNumber : CHU975156
NumberOfBoxes : 1
NumberOfItems : 1
PackageLevel : case
PartNumber : CHU975156
ProductDescription :

Feature:

NC-559-ASM TPF Flux Anti-Wet No-Clean 100g Cream AMTECH Solder Paste

NC-559 as a leave-in help paste residue color is very light, there is a very value of SIR.

Recommended for BGA, CSP and other solder ball array repair and fill the ball.

When using smoke less, no residue. Affordable.

Suitable for :

North and south bridge, cards, cell phone chip, video chip BGA solder, bumping.

Also can use off the tin, the effect is very ideal.

The residue was less bright spot, less smoke, no pungent odor, do not run the ball.

Package Included:

1 x Solder paste

ProductSiteLaunchDate : 2023-06-21T16:01:35.471Z
SafetyDataSheetUrl : http://eurotool-com.3dcartstores.com/assets/images/Aquiflux.pdf
SupplierDeclaredDgHzRegulation : ghs
UnitCount : 1
UnspscCode : 23271800