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Specification
Brand : DIYPHONE
BulletPoint1 : ♔BGA Silicone Pad:With strong magnetic adsorption, high temperature resistant and easy to clean, soft silicone material.
BulletPoint2 : ♔Insulation Mat: The design of the heat dissipation hole, makes the steel mesh plant tin without bulging.
BulletPoint3 : ♔BGA Reballing Stencil Mat:The strong magnetic design makes the steel mesh not easy to fall and shift, and the planting tin is more stable.
BulletPoint4 : ♔Universal BGA Stencil Magnetic Base: The storage tank design makes the work more convenient.
BulletPoint5 : ♔Silicone Tin Planting Pad:Multi-grid Division, Three Chip Slots.Meet the requirements for chip tinning of various thicknesses and specifications, and multi-slots are widely used.
Color : Blue
ExternallyAssignedProductIdentifier1 : 0679070215777
ExternallyAssignedProductIdentifier2 : 679070215777
IncludedComponents : 1X Silicone Tin Planting Pad
ItemName : BGA Silicone Pad, Insulation Mat, BGA Reballing Stencil Mat, Universal BGA Stencil Magnetic Base, Silicone Tin Planting Pad, Tin Planting Platform for Mobile Phone CPU Chip Soldering BGA Reballing
ItemPackageDimensions_Height : 0.5 inches
ItemPackageDimensions_Length : 10 inches
ItemPackageDimensions_Width : 8 inches
ItemTypeKeyword : soldering-stations
Manufacturer : DIYPHONE
Material : silicone
ModelName : Universal BGA Stencil Magnetic Base
ModelNumber : BGA Silicone Pad
PartNumber : sda2/18127
PowerSourceType : Manual
ProductDescription : Soft Silicone Magnetic Pad For Mobile Phone Repair High Temperature Resistance Planting Tin Position Working Cushion
ProductSiteLaunchDate : 2025-05-08T07:00:00.000Z
SupplierDeclaredDgHzRegulation : other
SupplierDeclaredHasProductIdentifierExemption : 1
UnitCount : 1
UnspscCode : 23270000