CYTGOUPER HT?90 90x90 BGA Reballing Station, Aluminum Alloy BGA Reballing Stencil, BGA Reball Stencil for 9-43mm BGA Chip and Laptop CPU Mobile Phone Rework

Imported from USA | Ships in 10 working days

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1

₹ 7600/-

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Product Information


Specification
Brand : CYTGOUPER
BulletPoint1 : ALUMINUM ALLOY: The BGA reballing station combines lightweight portability with steady support for repeated heating cycles during component repairs
BulletPoint2 : EASY TO USE: The BGA reballing stencil is marked on the exterior, convenient for you to choose and use them on the reballing station
BulletPoint3 : CHIP COMPATIBILITY: This BGA reball stencil handles chips from 9mm to 43mm, using metal plating to help heat spread evenly during reflow
BulletPoint4 : DIVERSION GROOVE: The reballing kit includes adjustable sizing dials and spillway channels to quickly remove extra solder without interrupting tasks
BulletPoint5 : APPLICATION: The BGA rework station can be used for laptop CPU, mobile phone digital products plant tin rework with BGA manual welding
Color : White
ExternallyAssignedProductIdentifier : 6974443672312
ExternallyAssignedProductIdentifier1 : 0840403706020
ExternallyAssignedProductIdentifier2 : 840403706020
IncludedComponents : 1 x BGA Reballing Station 1 x Hex Wrench
ItemName : CYTGOUPER HT‑90 90x90 BGA Reballing Station, Aluminum Alloy BGA Reballing Stencil, BGA Reball Stencil for 9-43mm BGA Chip and Laptop CPU Mobile Phone Rework
ItemPackageDimensions_Height : 2.36 inches
ItemPackageDimensions_Length : 5.91 inches
ItemPackageDimensions_Width : 5.12 inches
ItemPackageQuantity : 1
ItemTypeKeyword : soldering-stations
LowerTemperatureRating : 302 degrees_fahrenheit
Manufacturer : CYTGOUPER
Material : Aluminum alloy
ModelName : CYTGOUPER314DJZZT
ModelNumber : CYTGOUPER314DJZZT
NumberOfChannels : 1
NumberOfItems : 1
PartNumber : CYTGOUPER314DJZZT
PowerSourceType : no
ProductDescription :

Item Type: BGA Reballing Station

Product Model: HT-90 90x90

Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in

Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in

Material: Aluminum alloy

Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.


Package List:

1 x BGA Reballing Station

1 x Hex Wrench


ProductSiteLaunchDate : 2025-03-14T09:23:07.477Z
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
TemperatureStability : 2000 degrees_fahrenheit
UnitCount : 1
UnspscCode : 23271800
UpperTemperatureRating : 2100 degrees_celsius
Voltage : 110 volts
Wattage : 48 watts

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