Specification Brand : Fafeicy BulletPoint1 : for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. BulletPoint2 : Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature. BulletPoint3 : Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very for long term using. BulletPoint4 : Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it. BulletPoint5 : Fitting: Allows for wide application on for SDM450, 660, SM6150, MT6762 CPU as well as for A60‑A90 series, A10S, A605F, A705F and more. ExternallyAssignedProductIdentifier : 6974443672312 ExternallyAssignedProductIdentifier1 : 0840403706020 ExternallyAssignedProductIdentifier2 : 840403706020 IncludedComponents : Case ItemName : Reballing Stencil, Stainless Steel Phone CPU Reball Rework Template Screen for A60 to A90, Soldering Stations ItemPackageDimensions_Height : 23 centimeters ItemPackageDimensions_Length : 1.1 centimeters ItemPackageDimensions_Width : 13.3 centimeters ItemPackageQuantity : 1 ItemTypeKeyword : soldering-stations LowerTemperatureRating : 302 degrees_fahrenheit Manufacturer : Fafeicy Material : quartz ModelName : Fafeicy0nig12to4e ModelNumber : Fafeicy0nig12to4e NumberOfChannels : 1 NumberOfItems : 1 PartNumber : Fafeicy0nig12to4e PowerSourceType : Hand Powered ProductDescription : Specification: Item Type: Phone CPU BGA Reballing Stencil Product Material: Stainless Steel Spacing: 0.12mm Applicable CPU: For SDM450, 660, SM6150, MT6762 CPU. Applicable Product Model: For A60-A90 series, A10S, A605F, A705F, A920F.