Specification Amperage : 5 amps Brand : Tgoon BulletPoint1 : This reballing station adopt high quality aluminum alloy material as structure , light and BulletPoint2 : This product is a BGA universal diagonal ball planting fixture with all aluminium alloy plating BulletPoint3 : Not easy to oxidize , more wear‑resistant , and more suitable for 9mm to 43mm BGA chip ball planting BulletPoint4 : Adjust the chip size knob and set the diversion groove to facilitate the pour out of excess tin beads BulletPoint5 : Used for laptop CPU , mobile phone digital products plant tin rework with BGA manual welding Color : Us ExternallyAssignedProductIdentifier : 8480686027362 ExternallyAssignedProductIdentifier1 : 0761099773007 ExternallyAssignedProductIdentifier2 : 761099773007 GpsrSafetyAttestation : 1 IncludedComponents : inc ItemName : Tgoon BGA Stencil Holder , Universal Luminum Alloy 90x90 Reballing Station HT‑90 for BGA Chip Ball Planting ItemPackageDimensions_Height : 2.36 inches ItemPackageDimensions_Length : 5.91 inches ItemPackageDimensions_Width : 5.91 inches ItemPackageQuantity : 1 ItemTypeKeyword : soldering-stations Manufacturer : Tgoon Material : copper ModelName : YU-155 ModelNumber : YU-155 NumberOfChannels : 3 NumberOfItems : 1 PartNumber : Tgoonc30q2h6p895434 PowerSourceType : PowerSource ProductDescription : Feature : 1 . This reballing station adopt high quality aluminum alloy material as structure , light and 2 . This product is a BGA universal diagonal ball planting fixture with all aluminium alloy plating 3 . Not easy to oxidize , more wear‑resistant , and more suitable for 9mm to 43mm BGA chip ball planting 4 . Adjust the chip size knob and set the diversion groove to facilitate the pour out of excess tin beads 5 . Used for laptop CPU , mobile phone digital products plant tin rework with BGA manual welding
Specification :
Item Type : BGA Reballing Station Product Model : HT 90 90x90 Applicable Steel Mesh : Approx . 90 x 90mm / 3 . 5 x 3 . 5in Application Chip : Minimum clamping chip : approx . 9 x 9mm / 0 . 4 x 0 . 4in , maximum clamping chip : approx . 43 x 43mm / 1 . 7 x 1 . 7in Material : Aluminum alloy Application : BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products .
Package List : 1 x BGA Reballing Station 1 x Hex Wrench