Xolsurg BGA Reballing Station Aluminum Alloy Kit HT90 90x90 Laptop CPU Mobile Phone

Imported from USA | Ships in 10 working days

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1

₹ 8900/-

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Product Information


Specification
Brand : Xolsurg
BulletPoint1 : [HIGH-QUALITY MATERIAL] This reballing station is constructed with premium aluminum alloy, ensuring durability and lightness.
BulletPoint2 : [UNIVERSAL DESIGN] The BGA universal diagonal ball planting fixture is suitable for 9mm to 43mm BGA chip ball planting.
BulletPoint3 : [EASY TO USE] Adjust the chip size knob and diversion groove easily pour out excess tin beads during rework.
BulletPoint4 : [VERSATILE APPLICATION] Ideal for plant tin rework of laptop CPU and mobile phone digital products.
BulletPoint5 : [ AND WEAR-] Not easy to oxidize, providing more longevity and suitability for various reworking tasks.
IncludedComponents : No
ItemName : Xolsurg BGA Reballing Station Aluminum Alloy Kit HT90 90x90 Laptop CPU Mobile Phone
ItemPackageDimensions_Height : 6 centimeters
ItemPackageDimensions_Length : 15 centimeters
ItemPackageDimensions_Width : 15 centimeters
ItemTypeKeyword : soldering-stations
Manufacturer : Xolsurg
Material : Iron
ModelName : Xolsurgbvcyn31fs9
ModelNumber : Xolsurgbvcyn31fs9
NumberOfBoxes : 1
NumberOfItems : 1
PartNumber : Xolsurgbvcyn31fs9
PowerSourceType : ac/dc
ProductDescription : [HIGH-QUALITY MATERIAL] This reballing station is constructed with premium aluminum alloy, ensuring durability and lightness.
[UNIVERSAL DESIGN] The BGA universal diagonal ball planting fixture is suitable for 9mm to 43mm BGA chip ball planting.
[EASY TO USE] Adjust the chip size knob and diversion groove easily pour out excess tin beads during rework.
[VERSATILE APPLICATION] Ideal for plant tin rework of laptop CPU and mobile phone digital products.
[ AND WEAR-] Not easy to oxidize, providing more longevity and suitability for various reworking tasks.

Spec:
Item Type: BGA Reballing Station
Product Model: HT-90 90x90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.


Package List:
1 x BGA Reballing Station
1 x Hex Wrench




ProductSiteLaunchDate : 2025-02-19T02:40:02.879Z
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1
UnspscCode : 23271800

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