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Specification
Brand : Multizenic
BulletPoint1 : High Quality Material: Made of aluminum alloy, this BGA reballing station is light, , and not easy to oxidize, ensuring long-lasting performance and wear .
BulletPoint2 : Universal Application: Designed for BGA manual soldering, this station is suitable for plant tin rework of laptop CPUs and mobile phone digital products, making it a versatile tool for professionals.
BulletPoint3 : Adjustable Chip Size: Features a chip size knob and diversion groove that allow for easy adjustment and facilitate the pour out of excess tin beads, ensuring precise and efficient soldering.
BulletPoint4 : Wide Chip Compatibility: Accommodates a range of chip sizes from approximately 9x9mm to 43x43mm, making it compatible with various BGA chips and meeting different soldering needs.
BulletPoint5 : Complete Package: Comes with a hex wrench for easy installation and adjustment, providing a convenient and Effortless experience for users.
Capacity : 11 ounces
CareInstructions : Dishwasher Safe
Color : White/Black
IncludedComponents : Handle
ItemDisplayDimensions_Height : 0.39 inches
ItemDisplayDimensions_Length : 2.87 inches
ItemDisplayDimensions_Width : 0.39 inches
ItemDisplayWeight : 0.09 pounds
ItemName : BGA Reballing Station HT 90 90x90, Universal Diagonal Stencil Solder Kit, Aluminum Alloy Material, Manual Tools for Laptop CPU and Mobile Phone Digital Products Plant Tin Rework
ItemPackageDimensions_Height : 6 centimeters
ItemPackageDimensions_Length : 15 centimeters
ItemPackageDimensions_Width : 15 centimeters
ItemTypeKeyword : spot-welding-equipment
Manufacturer : Multizenic
Material : Ceramic
ModelName : Multizenicb82gm4vsyk
ModelNumber : Multizenicb82gm4vsyk
NumberOfItems : 1
OccasionType1 : Birthday
OccasionType2 : Christmas
OccasionType3 : New Year
PartNumber : Multizenicb82gm4vsyk
ProductDescription :
Item Type: BGA Reballing Station
Product Model: HT-90 90x90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.

Package List：
1 x BGA Reballing Station
1 x Hex Wrench

ProductSiteLaunchDate : 2024-12-18T02:51:47.829Z
Size : 11oz
Style : Classic
SupplierDeclaredDgHzRegulation : unknown
SupplierDeclaredHasProductIdentifierExemption : 1
UnitCount : 1
UnspscCode : 23271800