Specification Brand : Hilitand BulletPoint : Sold on Amazon BulletPoint1 : 6 in 1 design, which can implant a plurality of chips BulletPoint2 : It is easy and fast for reballing the BGA IC, useful and economical accessories for BGA soldering. BulletPoint3 : It adopted the special plump design which can avoid Heat dissipation BulletPoint4 : It is specially designed for BGA153/162/169/186/221/254/EMMC BulletPoint5 : These stencils were made of high quality stainless steel plate, the thickness of steel mesh is appropriate. ExternallyAssignedProductIdentifier1 : 0662310314057 ExternallyAssignedProductIdentifier2 : 662310314057 GpsrSafetyAttestation : 1 ItemName : BGA Stencils, BGA Reballing Stencil Kits, Template Mesh Directly Heat Set Kit, for BGA153/ 162/169/ 186/221/ 254/ EMMC ItemPackageDimensions_Height : 11 centimeters ItemPackageDimensions_Length : 0.7 centimeters ItemPackageDimensions_Width : 9.9 centimeters ItemPackageQuantity : 1 ItemTypeKeyword : spot-welding-equipment Manufacturer : Hilitand ModelNumber : Hilitandh8v25s0zn1 PartNumber : Hilitandh8v25s0zn1 ProductDescription : Features: 1.6 in 1 design, which can implant a plurality of chips. 2.These stencils were made of high quality stainless steel plate, the thickness of steel mesh is appropriate. 3.It adopted the special plump design which can avoid Heat dissipation. 4.It is easy and fast for reballing the BGA IC, useful and economical accessories for BGA soldering. 5.It is specially designed for BGA153/ 162/ 169/ 186/ 221/ 254/ EMMC.
Notice: 1.Please allow 13 cm error due to manual measurement. Thanks for your understanding. 2.Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.