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Specification
Brand : Hilitand
BulletPoint1 : [Portable Maintenance Tool] This cpu tinning stencil is portable and user-friendly, making it an excellent maintenance and diy tool for professionals and enthusiasts alike.
BulletPoint2 : [Precise Ic Protection] Multiple ic recesses with a half engraving process prevent small ics from sticking to tin and protect them from breakages, ensuring the safety of delicate components.
BulletPoint3 : [Accurate Positioning] The tin planting stencil offers precise positioning and a compact design, suitable for various applications and easy to use on-the-go.
BulletPoint4 : [Highly Efficient Tinning] The cpu tin reballing stencil ensures high efficiency tinning for s9 and s9+, supporting snapdragon 845 and 9810 cpus.
BulletPoint5 : [ Material] Made of stainless steel, this stencil withstands high temperatures without changes, allowing fast tinning to improve efficiency.
ItemName : Fast Tinning CPU Tin Reballing Stencil with IC Recess for S9 Series
ItemPackageDimensions_Height : 1 centimeters
ItemPackageDimensions_Length : 10 centimeters
ItemPackageDimensions_Width : 8 centimeters
ItemTypeKeyword : spot-welding-equipment
Manufacturer : Hilitand
ModelName : Hilitandswm0ph4v32
ModelNumber : Hilitandswm0ph4v32
PartNumber : Hilitandswm0ph4v32
ProductDescription : Spec:

Item Type: Phone Tin Reballing Stencil
Material: Stainless steel
Pitch: Approx. 0.12mm / 0.005in
Applicable CPU: For Snapdragon 845 and for 9810 CPU
Applicable Model: For S9 and for S9+ series



Package List:
1 x Phone Tin Reballing Stencil

How To Use:
Direct to use.


ProductSiteLaunchDate : 2024-08-13T17:27:07.374Z