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Specification
Brand : Eujgoov
BulletPoint1 : for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners.
BulletPoint2 : Fitting: Allows for wide application on for SDM450, 660, SM6150, MT6762 CPU as well as for A60‑A90 series, A10S, A605F, A705F and more.
BulletPoint3 : Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very for long term using.
BulletPoint4 : Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature.
BulletPoint5 : Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.
BulletPoint6 : The spot welder pen is small in size and light in weight, which makes it portable and convenient to use.
Color : Silver
CustomerPackageType : Standard Packaging
ExternallyAssignedProductIdentifier : 7016230585586
ExternallyAssignedProductIdentifier1 : 0743129626682
ExternallyAssignedProductIdentifier2 : 743129626682
ExternallyAssignedProductIdentifier3 : 0971473182657
FinishType : Finish
FinishType1 : Finish
FinishType2 : Finish
FinishType3 : Finish
FinishType4 : Finish
FinishType5 : Finish
IncludedComponents : inc
IncludedComponents1 : inc
IncludedComponents2 : inc
IncludedComponents3 : inc
IncludedComponents4 : inc
IncludedComponents5 : inc
ItemDisplayDimensions_Height : 2.3 inches
ItemDisplayDimensions_Length : 12.7 inches
ItemDisplayDimensions_Width : 5.8 inches
ItemDisplayWeight : 0.7 pounds
ItemForm : Roll
ItemName : Reballing Stencil Kits, Reballing Stencil Universal Directly Heat Tin Planting Equipment Stainless Steel for Phone CPU
ItemPackageDimensions_Height : 1 centimeters
ItemPackageDimensions_Length : 10 centimeters
ItemPackageDimensions_Width : 8 centimeters
ItemPackageQuantity : 1
ItemShape : Rectangular
ItemTypeKeyword : spot-welding-equipment
Manufacturer : Eujgoov
Material : Alloy Steel
Material1 : Material
Material2 : Material
Material3 : Material
Material4 : Material
Material5 : Material
Material6 : Material
Material7 : Material
Material8 : Material
Material9 : Material
ModelName : Eujgoovdremt6fw2v
ModelNumber : Eujgoovdremt6fw2v
NumberOfItems : 1
PackageLevel : unit
PartNumber : Eujgoovdremt6fw2v
PowerSourceType : PowerSource
ProductDescription : Specification:
Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For SDM450, 660, SM6150, MT6762 CPU.
Applicable Product Model: For A60-A90 series, A10S, A605F, A705F, A920F.

How to Use:
Direct use.

Package List:
1 x Phone CPU BGA Reballing Stencil

ProductSiteLaunchDate : 2023-02-22T17:03:02.379Z
Size : 0.15mm X 8mm 3M
StreetDate : 2015-05-14T00:00:01Z
Style : Classic
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredDgHzRegulation1 : not_applicable
SupplierDeclaredDgHzRegulation2 : not_applicable
SupplierDeclaredDgHzRegulation3 : not_applicable
SupplierDeclaredDgHzRegulation4 : not_applicable
SupplierDeclaredDgHzRegulation5 : not_applicable
UnitCount : 1