Reballing Stencil Stencil 10×10×1 Universal Reballing Stencil Multifunctional Tin Mesh Solder Template for Phone IC Chips Repair Stencil Reballing Stencil

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₹ 4700/-

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Product Information


Specification
Brand : OUCRIY
BulletPoint1 : Material: Tin mesh soldering stencil is made of high quality stainless steel, which is not easy to be damaged and has a service life. reballing stencil
BulletPoint2 : four pitches This universal reballing stencil features three types of holes with pitches of 0.3, 0.35, 0.4 and 0.5, providing versatile options for different IC chips. soldering station
BulletPoint3 : positioning tin gauze soldering template fast tin implantation with positioning even under high temperatures.
BulletPoint4 : compact appearance the compact appearance of the universal reballing stencil makes it easy to carry and use wherever you go.
BulletPoint5 : reballing stencil, compact and portable the universal reballing stencil is compact, making it easy to carry and use when you need it.
Capacity : 15 ounces
CareInstructions : Dishwasher Safe
Color : White
IncludedComponents : Handle
ItemName : Reballing Stencil Stencil 10×10×1 Universal Reballing Stencil Multifunctional Tin Mesh Solder Template for Phone IC Chips Repair Stencil Reballing Stencil
ItemPackageDimensions_Height : 1 centimeters
ItemPackageDimensions_Length : 10 centimeters
ItemPackageDimensions_Width : 10 centimeters
ItemTypeKeyword : spot-welding-equipment
Manufacturer : OUCRIY
Material : Ceramic
ModelName : OUCRIYy2rzhuevx8
ModelNumber : OUCRIYy2rzhuevx8
NumberOfItems : 1
OccasionType1 : Birthday
OccasionType2 : Christmas
OccasionType3 : New Year
PartNumber : OUCRIYy2rzhuevx8
ProductDescription : 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with pitch of 0.3 0.35 0.4 0.5, four types of spacing and multiple sizes.
2. PRECISE POSITIONING: Tin mesh soldering template is precisely positioned for fast tin implantation, and the ball template will not change under high temperatures.
3. COMPACT APPEARANCE: The universal BGA reballing stencil has a compact appearance and is easy to carry and use.
4. VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in mobile phones today, and can meet your different needs.
5. STAINLESS STEEL MATERIAL: Tin mesh soldering template is made of high quality stainless steel, which is not easy to be damaged and has a long service life.

Specification:
Item Type: BGA Reballing Stencil
Pitch: 0.3mm/0.012inch, 0.35mm/0.014inch, 0.4/0.016inch, 0.5mm/0.020inch
Product material: stainless steel

How to use:
Use immediately

Package list:
1 xBGA Reballing Stencil
ProductSiteLaunchDate : 2024-11-03T18:31:18.647Z
Size : 15oz
Style : Classic
SupplierDeclaredDgHzRegulation : unknown
SupplierDeclaredHasProductIdentifierExemption : 1
UnitCount : 1
UnspscCode : 23270000

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