Specification Brand : YWBL-WH BulletPoint1 : [STAINLESS STEEL MATERIAL] - Made of premium stainless steel, the tin mesh solder template is , ensuring a long service life. BulletPoint2 : [VERSATILE] - This BGA reballing stencil is suitable for common IC chips used in cell phones, meeting a variety of repair needs. BulletPoint3 : [FOUR PITCHES] - With three types of holes and four spacing options, the stencil supports multiple sizes and pitches for enhanced compatibility. BulletPoint4 : [ POSITIONING] - The tin mesh solder template allows for fast and accurate tin implantation, ensuring placement during repair. BulletPoint5 : [COMPACT APPEARANCE] - The universal BGA reballing stencil has a compact size, making it easy to carry and use for on-the- repairs. ExternallyAssignedProductIdentifier : 9424126628732 ExternallyAssignedProductIdentifier1 : 0764980794785 ExternallyAssignedProductIdentifier2 : 764980794785 HeatingElementType : Copper, Radiant IncludedComponents : 2 x Spot Welding Pin, 1 x Wrench, 1 x Slot Screwdriver, 1 x English User Manual InstallationType : Freestanding ItemForm : Liquid ItemName : Reballing Stencils Universal Reballing Rework Net Stencils Steel Template 0.3 0.35 0.4 0.5 for Cellphones ItemPackageDimensions_Height : 1 centimeters ItemPackageDimensions_Length : 10 centimeters ItemPackageDimensions_Width : 10 centimeters ItemPackageQuantity : 1 ItemTypeKeyword : spot-welding-equipment Manufacturer : YWBL-WH Material : Material ModelName : YWBL-WH47qgywud3p ModelNumber : YWBL-WH47qgywud3p NumberOfItems : 1 PartNumber : YWBL-WH47qgywud3p PowerSourceType : Corded Electric ProductDescription : Specification: Item Type: BGA Reballing Stencil Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in Product Material: Stainless Steel