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Specification
Brand : Respicefinem
BulletPoint1 : Precise Positioning Tin Plated Stencil Be Precisely Positioned With Compact Appearance And Be Used In Different Applications.
BulletPoint2 : Phe, Suitable : The Tin Reballing Stencil Is Specially For S9 And S9 Series, With Compatibility For Snapdragon 845 And 9810 Cpu Chips.
BulletPoint3 : Positig, Suitable : The Cpu Tin Reballing Stencil Is Suitable For S9 And S9 Series, For Snapdragon 845 And For 9810 Cpu.
BulletPoint4 : Easy To Use Portable And User Friendly, The Cpu Tinning Stencil Is Great Tool For Maintenance And Diy Projects.
BulletPoint5 : Suitable The Cpu Tin Reballing Stencil Is For S9 And S9 Series, Compatible With Snapdragon 845 And 9810 Cpu, Cpu.
Color : As Shown 1
IncludedComponents : control board
ItemDisplayDimensions_Height : 0.79 inches
ItemDisplayDimensions_Length : 4.13 inches
ItemDisplayDimensions_Width : 2.36 inches
ItemDisplayWeight : 0.16 pounds
ItemName : Respicefinem Plantg Series 10×8×1 Phone Tin Reballing Stencil Accurate Positioning Cpu Tin Planting Template For S9 Series
ItemPackageDimensions_Height : 1 centimeters
ItemPackageDimensions_Length : 10 centimeters
ItemPackageDimensions_Width : 8 centimeters
ItemTypeKeyword : spot-welding-equipment
Manufacturer : Respicefinem
Material : PCB, Electronics component
ModelName : Respicefinemf5zs94nvrh
ModelNumber : Respicefinemf5zs94nvrh
NumberOfBoxes : 1
NumberOfItems : 1
PartNumber : Respicefinemf5zs94nvrh
ProductDescription : Item Type: Phone Tin Reballing Stencil
Material: Stainless steel
Pitch: Approx. 0.12mm / 0.005in
Applicable CPU: For Qualcomm Snapdragon 845 and for Exynos 9810 CPU
Applicable Model: For S9 and for S9+ series

Package List：
1 x Phone Tin Reballing Stencil

ProductSiteLaunchDate : 2025-02-19T04:50:47.409Z
Size : 10.50X6.00X2.00CM
Style : Modern
SupplierDeclaredDgHzRegulation : not_applicable
UnspscCode : 44111800
WarrantyDescription : Manufacturer warranty for 90 day