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Specification
Brand : Chip Quik
BulletPoint : Thermoset Chip Bonding Epoxy
BulletPoint1 : Perfect for Salt Wall Projects: Specifically designed for use with Himalayan salt materials, ensuring a secure and professional-looking finish.
BulletPoint2 : Strong & Durable Bond: Creates a robust, long-lasting seal between Himalayan salt bricks, tiles, and blocks. Ideal for constructing beautiful and durable salt walls.
BulletPoint3 : Easy Application: Smooth and consistent application for clean, professional-looking results. 100% adhesive Easy to use with a caulking gun.
BulletPoint4 : High-Quality Formulation: Made with premium ingredients for a strong, reliable, and long-lasting bond.
BulletPoint5 : Includes 4 Packs: Convenient value pack with two tubes of adhesive, providing ample supply for your salt wall projects.
BulletPoint6 : No health hezard fumes
BulletPoint7 : Unique double packs provide clean and easy-use, much easier to use than syringes or mixer trays
BulletPoint8 : Unique double packs provide clean and easy-use, much easier to use than syringes or mixer trays
Color : Red
CompatibleMaterial : Stone
CompatibleMaterial1 : Fiberglass
CompatibleMaterial2 : Metal
CompatibleMaterial3 : Plastic
CompatibleMaterial4 : Wood
CompatibleMaterial5 : Ceramic
CompatibleMaterial6 : Rubber
CompatibleMaterial7 : Other
ExternallyAssignedProductIdentifier1 : 721718004295
ExternallyAssignedProductIdentifier2 : 0721718004295
FcShelfLife : 365 days
Hazmat : 9
Hazmat1 : ENVIRONMENTALLY HAZARDOUS SUBSTANCE, LIQUID, N.O.S., (4,4'-Isopropylidenediphenol, oligomeric reaction products with 1-chloro-2,3-epoxypropane)
Hazmat10 : DE_Unregulated
Hazmat11 : EG_Unregulated
Hazmat12 : ES_Unregulated
Hazmat13 : FR_Unregulated
Hazmat14 : GB_Unregulated
Hazmat15 : IE_Unregulated
Hazmat16 : IN_Unregulated
Hazmat17 : IT_Unregulated
Hazmat18 : JP_Unregulated
Hazmat19 : MX_Unregulated
Hazmat2 : UN3082
Hazmat20 : NL_Unregulated
Hazmat21 : PL_Unregulated
Hazmat22 : SA_Unregulated
Hazmat23 : SE_Unregulated
Hazmat24 : SG_Unregulated
Hazmat25 : TR_Unregulated
Hazmat26 : US_Unregulated
Hazmat27 : ZA_Unregulated
Hazmat28 : 9
Hazmat3 : III
Hazmat4 : AE_Unregulated
Hazmat5 : AU_Unregulated
Hazmat6 : BE_Unregulated
Hazmat7 : BR_Unregulated
Hazmat8 : CA_Unregulated
Hazmat9 : CN_Unregulated
IncludedComponents : Syringe, Plunger, Dispensing Tips
IsExpirationDatedProduct : 1
ItemForm : Liquid
ItemName : CHIP QUIK AD7-5S Thermoset Chip Bonding Epoxy (Red) 5g/5cc Syringe (Thermal (Heat) Cure Adhesive/Glue)
ItemPackageDimensions_Height : 0.5 inches
ItemPackageDimensions_Length : 5 inches
ItemPackageDimensions_Width : 3 inches
ItemPackageQuantity : 1
ItemTypeKeyword : tile-epoxy-adhesives
ItemVolume : 16 fluid_ounces
Manufacturer : Chip Quik
Material : Epoxy
Material1 : Epoxy Resin
Material2 : Resin
ModelNumber : AD7-5S
NumberOfItems : 1
NumberOfPieces : 4
PackageLevel : case
PartNumber : AD7-5S
ProductDescription : Description: Heat curing epoxy chip bonding adhesive designed to bond surface mount chips and ICs to printed circuit boards (PCBs). Low Viscosity. Designed to be dot/line dispensed. Allows large/heavy surface mount components to be permanently bonded to a PCB during reflow, allowing two sided surface mount reflow without larger chips/ICs coming loose. Curing Time: 120-180 seconds at 190+ Celsius (374+ F). Recommended Curing Temperature: 190 to 260C (374 to 500F). Maximum Curing Temperature: 260C (500F). Designed to cure at leaded (Sn63/Pb37) and lead free (SAC305) reflow temperatures. Maximum recommended dot size: 10mm x 10mm x 1mm (100mm^3). Specifications (After Curing): Operating Temperature Range: -40 to 125C (-40 to 257F) (After Curing, After Reflow). Density: 1.4g/cc. Viscosity (Malcom @ 5 RPM, 25C): 44 Pa-s (44,000 mPa-s). Size: 5g/5cc syringe. Shelf Life: Refrigerated >24 months, unrefrigerated >24 months. Stencil Life: >12 hours @ 20-50% RH 22-28C (72-82F). >8 hours @ 50-70% RH 22-28C (72-82F). Cleaning: Clean using isopropyl alcohol (IPA). Storage and Handling: Store at 3-25C (37-77F). Do not freeze. Allow 4 hours for thermoset chip glue to reach an operating temperature of 20-25C (68-77F) before use. Transportation: This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2024-09-06T17:32:25.241Z
Size : 3 Gallon Kit
SpecificUsesForProduct : Bonding Components to Printed Circuit Boards during reflow to allow for secondary inverted reflow
SpecificUsesForProduct1 : For Joinig Himalayan Salt Bricks and Tiles
SpecificUsesForProduct2 : Compatible Size for caulking Gun
SpecificUsesForProduct3 : Adhesive
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
UnitCount : 0.1764
UnspscCode : 31201600
Viscosity : Medium
WaterResistanceLevel : water_resistant